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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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APM32F103C8T6-R датащи(PDF) 30 Page - Geehy Semiconductor Co., Ltd. |
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APM32F103C8T6-R датащи(HTML) 30 Page - Geehy Semiconductor Co., Ltd. |
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30 / 78 page  w w w. g e e h y. c o m P a g e 29 Symbol Parameter Condition Minimum value Maximum value Unit TA Ambient temperature (temperature number 6) Maximum power dissipation -40 85 ℃ Ambient temperature (temperature number 7) Maximum power dissipation -40 105 ℃ TJ Junction temperature range - -40 150 ℃ 1. When ADC is used, see 5.12.1 2. VDD and VDDA should be powered from the same power supply during power-up and normal operation, with a maximum of 300mV difference allowed between VDD and VDDA. 5.3 Absolute maximum rated value If the load on the device exceeds the absolute maximum rated value, it may cause permanent damage to the device. Here, only the maximum load that can be borne is given, and there is no guarantee that the device functions normally under this condition. 5.3.1 Maximum temperature characteristics Table12 Temperature Characteristics Symbol Description Value Unit TSTG Storage temperature range -55 ~ +150 ℃ TJ Maximum junction temperature 150 ℃ 5.3.2 Maximum rated voltage characteristics Table13 Maximum Rated Voltage Characteristics Symbol Description Minimum value Maximum value Unit VDD - VSS External main supply voltage (including VDDA and VDD) (1) -0.3 4.0 V VIN Input voltage on 5V pins (2) VSS-0.3 5.5 Input voltage on other pins (2) VSS-0.3 VDD + 0.3 | ΔVDDx | Voltage difference between different power supply pins 50 mV | VSSx-VSS | Voltage difference between different grounding pins 50 1． All power supply (VDD, VDDA) and ground (VSS, VSSA) must always be within the allowed range. 2． If VIN exceeds the maximum value, IINJ(PIN) must be externally limited not to exceed the maximum value. When VIN> VDD, the current flows into the pins; when VIN<VSS, the current flows out of the pins. |
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