6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

7.5

V

VI

Signal input terminals

(V–) – 0.5

(V+) + 0.5

V

II

Signal input terminals

–10

+10

mA

ISC

Output short-circuit(2)

Continuous

TA

Operating temperature

–55

125

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

2.5

5.5

V

TA

Specified temperature

–40

25

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA620

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

216.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

115.0

°C/W

RθJB

Junction-to-board thermal resistance

83.2

°C/W

ψJT

Junction-to-top characterization parameter

50.3

°C/W

ψJB

Junction-to-board characterization parameter

82.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

OPA620

SLOSEG2 – APRIL 2026

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