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R8152S032B датащи(PDF) 3 Page - Nisshinbo Micro Devices Inc. |
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R8152S032B датащи(HTML) 3 Page - Nisshinbo Micro Devices Inc. |
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3 / 28 page ![]() R8152x NO. EC-238-180730 3 PIN DESCRIPTIONS HSOP-6J TO-252-5-P2 1 3 6 4 2 5 1 2 3 4 5 *1 R8152S: HSOP-6J Pin No. Symbol Description 1 VDD Input Voltage 2 GND* Ground Pin 3 GND* Ground Pin 4 CE Chip Enable Pin (“H” Active) 5 GND* Ground Pin 6 VOUT Output Pin *) No. 2, No. 3 and No. 5 pins must be wired to the GND plane when they are mounted on board. R8152J: TO-252-5-P2 Pin No. Symbol Description 1 VDD Input Voltage 2 GND* Ground Pin 3 GND* Ground Pin 4 CE Chip Enable Pin (“H” Active) 5 VOUT Output Pin *1 The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left open. *) No. 2 and No. 3 pins must be wired to the GND plane when they are mounted on board. |
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