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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST7FOXK2 датащи(PDF) 224 Page - STMicroelectronics |
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ST7FOXK2 датащи(HTML) 224 Page - STMicroelectronics |
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224 / 226 page  Package mechanical data ST7FOXF1, ST7FOXK1, ST7FOXK2 224/226 14.1 Thermal characteristics Table 101. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) LQFP32 SDIP32 SO20 DIP20 55 58 76 63 °C/W TJmax Maximum junction temperature(1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation(2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. 160 mW |
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