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ST7FOXK2 датащи(PDF) 220 Page - STMicroelectronics |
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ST7FOXK2 датащи(HTML) 220 Page - STMicroelectronics |
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220 / 226 page ![]() Package mechanical data ST7FOXF1, ST7FOXK1, ST7FOXK2 220/226 14 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 94. 20-pin plastic small outline package, 300-mil width, package outline Table 97. 20-pin plastic small outline package, 300-mil width, mechanical data Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 2.35 2.65 0.0925 0.1043 A1 0.10 0.30 0.0039 0.0118 B 0.33 0.51 0.0130 0.0201 C 0.23 0.32 0.0091 0.0126 D 12.60 13.00 0.4961 0.5118 E 7.40 7.60 0.2913 0.2992 e 1.27 0.0500 H 10.00 10.65 0.3937 0.4193 h 0.25 0.75 0.0098 0.0295 α 0° 8° 0° 8° L 0.40 1.27 0.0157 0.0500 Number of Pins N20 EH A A1 B e D c h x 45× L a |
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