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AP320N10TLG2 датащи(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP320N10TLG2 датащи(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP320N10TLG2 100V N-Channel Enhancement Mode MOSFET AP320N10TLG2 REV1.0 永源微電子科技有限公司 Electrical Characteristics (TC=25℃unless otherwise noted) Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 100 111 - V lGSS Gate-body Leakage current VDS = 0V, VGS = ±20V - - ±100 nA IDSS Zero Gate Voltage Drain Current TJ=25°C VDS = 100V, VGS = 0V - - 1 μA IDSS Zero Gate Voltage Drain CurrentTJ=100°C - - 100 VGS(th) Gate-Threshold Voltage VDS = VGS, ID = 250µA 2.0 3.0 4.0 V RDS(on) Drain-Source on-Resistance4 VGS = 10V, ID = 20A - 1.3 1.6 mΩ gfs Forward Transconductance4 VDS = 10V, ID =20A - 84 - S Ciss Input Capacitance VDS = 50V, VGS =0V, f =1MHz - 14300 - pF Coss Output Capacitance - 2120 - Crss Reverse Transfer Capacitance - 50 - Rg Gate Resistance f=1MHz - 2.8 - Ω Qg Total Gate Charge VGS = 10V, VDS = 50V, ID= 20A - 250 - nC Qgs Gate-Source Charge - 53 - Qgd Gate-Drain Charge - 77 - td(on) Turn-on Delay Time VGS =10V, VDD = 50V, RG = 3Ω, ID= 20A - 41 - ns tr Rise Time - 88 - td(off) Turn-off Delay Time - 163 - tf Fall Time - 98 - trr Body Diode Reverse Recovery Time IF=20A, di/dt = 100A/μs - 106 - ns Qrr Body Diode Reverse Recovery Charge - 245 - nC VSD Diode Forward Voltage4 IS = 20A, VGS = 0V - - 1.2 V IS Continuous Source Current TC=25°C - - 312 A Notes: 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≤ 300us , duty cycle ≤ 2% 3、The EAS data shows Max. rating . The test condition is VDD=90V, VGS=10V, L=1.0mH, IAS=50A 4、The power dissipation is limited by 150°C junction temperature 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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