AP240N04TLT2

40V N-Channel Enhancement Mode MOSFET

AP240N04TLT2 REV1.0

永源微電子科技有限公司

Electrical Characteristics (TJ=25℃, unless otherwise noted)

Symbol

Parameter

Test Condition

Min

Typ

Max

Units

V(BR)DSS

Drain-Source Breakdown Voltage

VGS=0V, ID=250μA

42

47

-

V

IDSS

Zero Gate Voltage Drain Current

VDS=40V, VGS=0V,

-

-

1.0

μA

IGSS

Gate to Body Leakage Current

VDS=0V, VGS= ±25V

-

-

±100

nA

VGS(th)

Gate Threshold Voltage

VDS=VGS, ID=250μA

1.2

1.6

2.5

V

RDS(on)

Static Drain-Source on-Resistance

VGS=10V, ID=30A

-

1.4

1.8

mΩ

RDS(on)

Static Drain-Source on-Resistance

VGS=10V, ID=20A

-

1.9

3.0

mΩ

Ciss

Input Capacitance

VDS=20V, VGS=0V,

f=1.0MHz

-

9060

-

pF

Coss

Output Capacitance

-

1000

-

pF

Crss

Reverse Transfer Capacitance

-

666

-

pF

Qg

Total Gate Charge

VDS=20V, ID=30A,

VGS=10V

-

145

-

nC

Qgs

Gate-Source Charge

-

30

-

nC

Qgd

Gate-Drain(“Miller”) Charge

-

37

-

nC

td(on)

Turn-on Delay Time

VDD=20V, ID=30A,

RL=1Ω, RGEN=3Ω,

VGS=10V

-

39

-

ns

tr

Turn-on Rise Time

-

56

-

ns

td(off)

Turn-off Delay Time

-

108

-

ns

tf

Turn-off Fall Time

-

71

-

ns

IS

Maximum Continuous Drain to Source Diode Forward Current

-

-

220

A

ISM

Maximum Pulsed Drain to Source Diode Forward Current

-

-

760

A

VSD

Drain to Source Diode Forward Voltage

VGS=0V, IS=30A

-

-

1.2

V

trr

Body Diode Reverse Recovery Time

TJ=25

℃,

IF=20A,dI/dt=100A/μs

-

50

-

ns

Qrr

Body Diode Reverse Recovery Charge

-

81

-

nC

Note :

1

、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.

2

、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%

3

、The EAS data shows Max. rating . The test condition is TJ=25℃,VDD=50V,VG=10V,L=0.5mH,Rg=25Ω,IAS=48A

4

、The power dissipation is limited by 150℃ junction temperature

5

、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.