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AP90N02NF датащи(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP90N02NF датащи(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP90N02NF 20V N-Channel Enhancement Mode MOSFET AP90N02NF RVE1.0 永源微電子科技有限公司 Electrical Characteristics (TC=25℃unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Units V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=250μA 20 22 - V IDSS Zero Gate Voltage Drain Current VDS=20V, VGS=0V - - 1 μA IGSS Gate to Body Leakage Current VGS= ±12V, VDS=0V - - ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS, ID=250μA 0.5 0.68 1.0 V RDS(on) Static Drain-Source On-Resistance VGS=10V, ID=20A 1.6 2.0 mΩ RDS(on) Static Drain-Source On-Resistance VGS=4.5V, ID=20A - 1.9 2.5 mΩ RDS(on) Static Drain-Source On-Resistance VGS=3.8V, ID=20A 2.5 3.2 mΩ RDS(on) Static Drain-Source On-Resistance VGS=2.5V, ID=20A 3.2 4.0 mΩ Ciss Input Capacitance VDS=10V, VGS=0V, f=1.0MHz - 4307 - pF Coss Output Capacitance - 501 - pF Crss Reverse Transfer Capacitance - 321 - pF Qg Total Gate Charge VDS=10V, ID=30A, VGS=4.5V - 48 - nC Qgs Gate-Source Charge - 3.6 - nC Qgd Gate-Drain(“Miller”) Charge - 19 - nC td(on) Turn-On Delay Time VDS =10V, ID=30A, RG=1.8Ω, VGS=4.5V - 9.7 - ns tr Turn-On Rise Time - 37 - ns td(off) Turn-Off Delay Time - 63 - ns tf Turn-Off Fall Time - 52 - ns IS Maximum Continuous Drain to Source Diode Forward Current - - 120 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 360 A VSD Drain to Source Diode Forward Voltage VGS=0V, ISD=30A, TJ=25℃ - - 1.2 V trr Reverse Recovery Time TJ=25°C, IF=30A, di/dt =100A/μs - 23 - ns Qrr Reverse Recovery Charge - 10 - nC Note : 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width .The EAS data shows Max. rating . 3、The EAS condition: TJ=25℃, VDD=16V, VG=4.5V, RG=25Ω, L=0.1mH, IAS=55A 4、The power dissipation is limited by 175℃ junction temperature 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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