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APM32E103CET6-R датащи(PDF) 39 Page - Geehy Semiconductor Co., Ltd. |
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APM32E103CET6-R датащи(HTML) 39 Page - Geehy Semiconductor Co., Ltd. |
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39 / 79 page ![]() www.g eeh y.co m Pag e 38 consult the corresponding manufacturer. Table 19 HSECLK4~16MHz Oscillator Characteristics Symbol Parameter Conditions Minimum value Typical value Maximum value Unit fOSC_IN Oscillator frequency - 4 8 16 MHz RF Feedback resistance - - 200 - kΩ IDD(HSECLK) HSECLK current consumption VDD=3.3V, CL=10pF@8MHz - - 0.56 mA tSU(HSECLK) Startup time VDD is stable - 0.85 - ms Note: It is obtained from a comprehensive evaluation and is not tested in production. 5.5.1.2. Low-speed external clock generated by crystal resonator For detailed parameters (frequency, package, precision, etc.) of crystal resonator, please consult the corresponding manufacturer. Table 20 LSECLK Oscillator Characteristics (fLSECLK=32.768KHz) Symbol Parameter Conditions Minimum value Typical value Maximum value Unit fOSF_IN Oscillator frequency - - 32.768 - KHz IDD(LSECLK) LSECLK current consumption - - - 0.8 μA tSU(LSECLK)(1) Startup time VDDIOx is stable - 0.93 - s Note: It is obtained from a comprehensive evaluation and is not tested in production. (1) tSU(LSECLK) is the startup time, which is measured from the time when LSECLK is enabled by software to the time when stable oscillation at 32.768KHz is obtained. This value is measured using a standard crystal resonator, which may vary greatly due to different crystal manufacturers. 5.5.2. Characteristics of internal clock source High speed internal (HSICLK) RC oscillator Table 21 HSICLK Oscillator Characteristics Symbol Parameter Conditions Minimum value Typical value Maximum value Unit fHSICLK Frequency - - 8 - MHz ACCHSICLK Accuracy of HSICLK oscillator Factory calibration VDD=3.3V, TA=25 ℃(1) -1 - 1 % VDD=2-3.6V, TA=-40~105 ℃ -1.5 - 1.5 % IDDA(HSICLK) Power consumption of HSICLK oscillator - - - 76 μA tSU(HSICLK) Startup time of HSICLK oscillator VDD=3.3V,TA=-40~105 ℃ 3.24 - 3.4 μs Note: It is obtained from a comprehensive evaluation and is not tested in production. |
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