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AP10P20DF датащи(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP10P20DF датащи(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP10P20DF -200V P-Channel Enhancement Mode MOSFET AP10P20DF REV1.0 永源微電子科技有限公司 P-Channel Electrical Characteristics (TJ =25 ℃, unless otherwise noted) Symbol Parameter Test Conditions Min Typ Max Unit VDS Drain-Source Breakdown Voltage VGS=0V, ID=- 250µA -200 V VGS(th) Gate-Source Threshold Voltage VDS=VGS, ID=-250µA -2.0 -3.0 -4.0 V IGSS Gate-Source Leakage VDS=0V, VGS=±20V ±100 nA IDSS Zero Gate Voltage Drain Current VDS=-200V, VGS=0V - 1 µA VDS=- 200V, VGS=0V, TJ=55 °C - 10 RDS(on) Drain-Source On-State Resistancea VGS=-10V, ID=-1A 620 850 mΩ VGS=-6V, ID=-1A 880 1100 gfs Forward Transconductancea VDS=-15V, ID=-1A 4 S Ciss Input Capacitance VDS=-50V, VGS=0 V, f=1MHz 666 pF Coss Output Capacitance 36 Crss Reverse Transfer Capacitance 25 Qg Total Gate Charge VDS=-100V, VGS=-10V, ID=-1A 16.2 25 nC Qgs Gate-Source Charge VDS=-100V, VGS=-6V, ID =-1A 2.5 Qgd Gate-Drain Charge 4.9 Rg Gate Resistance f = 1MHz 5.3 8 Ω td(on) Turn-On Delay Time VDD=-100V, RL=100Ω , VGEN=- 6V, Rg=1Ω 16 25 ns tr Rise Time 16 25 td(off) Turn-Off DelayTime 25 40 tf Fall Time 16 25 td(on) Turn-On Delay Time VDD=-100V, RL=100Ω VGEN=-10V, Rg=1Ω 9 15 tr Rise Time 11 18 td(off) Turn-Off DelayTime 27 42 tf Fall Time 12 20 IS Continuous Source-Drain Diode Current TC=25 °C - 5 A ISM Pulse Diode Forward Currenta - 5 VSD Body Diode Voltage IS =-1 A -0.8 - 1.2 V trr Body Diode Reverse Recovery Time IF=-4A, dI/dt=100A/µs, TJ= 25°C 66 90 ns Qrr Body Diode Reverse Recovery Charge 215 270 nC Note : 1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is VDD =-50V,VGS =-10V,L=0.5mH,IAS =-5A 4、The power dissipation is limited by 150℃ junction temperature 5、The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation. |
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