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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8309CVMAGFC датащи(PDF) 52 Page - NXP Semiconductors |
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MPC8309CVMAGFC датащи(HTML) 52 Page - NXP Semiconductors |
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52 / 81 page  MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 52 Freescale Semiconductor Package and Pin Listings 22 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 22.1, “Package Parameters for the MPC8309,” and Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,” for information on the MAPBGA. 22.1 Package Parameters for the MPC8309 The package parameters are as provided in the following list. Package outline 19 mm 19 mm Package Type MAPBGA Interconnects 489 Pitch 0.80 mm Module height (typical) 1.48 mm; Min = 1.31mm and Max 1.61mm Solder Balls 96 Sn / 3.5 Ag / 0.5 Cu (VM package) Ball diameter (typical) 0.40 mm 22.2 Mechanical Dimensions of the MPC8309 MAPBGA The following figure shows the mechanical dimensions and bottom surface nomenclature of the MPC8309, 489-MAPBGA package. |
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