TLE2142, TLE2142A, TLE2142Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION DUAL OPERATIONAL AMPLIFIERS

SLOS064B – DECEMBER 1990 – REVISED AUGUST 1994

5–3

POST OFFICE BOX 655303

symbol (each amplifier)

+

–

OUT

IN +

IN –

TLE2142Y chip information

This chip, when properly assembled, displays characteristics similar to the TLE2142. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN 4 IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

OUT

IN +

IN –

VCC+

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

IN +

IN –

OUT

(4)

VCC –

90

80

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)