DD.M14C32/9811V1.1

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M14C32 DD

M14C32 Die Description

PRODUCT

M14C32

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WAFER SIZE

152 mm (6 inches)

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DIE IDENTIFICATION M14C32KA_R

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DIE SIZE (X x Y)

2040 x 2355 µm

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SCRIBE LINE

100.5 x 101.7 µm

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PAD OPENING

100 x 100 µm

DIE LAYOUT

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DI

Die Identification (at the position shown in Figure 1)

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C1, C2, C3, C5, C7

Pad contacts to the ISO pins (at the positions shown in Figure 1)

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C4, C6, C8

These ISO pins do not appear on the M14C32 die

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NC

This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and

vertical axis, measured in µm).

Figure 1. M14C32 Die Plot

AI02495

C3: SCL

(X= –837.28; Y= –904.24)

C7: SDA (X= –649.92; Y= +993.44)

DI

NC: TEST

NC: TEST

NC: TEST

C5: GND (X= +718.0; Y= +1010.0)

C2: WC

(X= –648.48; Y= –993.6)

C1: VCC (X= +650.08; Y= –993.76)