DD.M14C16/9811V1.1

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M14C16 DD

M14C16 Die Description

PRODUCT

M14C16

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WAFER SIZE

152 mm (6 inches)

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DIE IDENTIFICATION M14C16KA_R

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DIE SIZE (X x Y)

1390 x 2375 µm

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SCRIBE LINE

101.8 x 102.4 µm

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PAD OPENING

100 x 100 µm

DIE LAYOUT

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DI

Die Identification (at the position shown in Figure 1)

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C1, C2, C3, C5, C7

Pad contacts to the ISO pins (at the positions shown in Figure 1)

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C4, C6, C8

These ISO pins do not appear on the M14C16 die

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NC

This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and

vertical axis, measured in µm).

Figure 1. M14C16 Die Plot

AI02496

C3: SCL (X= –514.4; Y= –904.4)

C7: SDA (X= –429.0; Y= +1004.3)

DI

NC: TEST

NC: TEST

NC: TEST

C5: GND (X= +337.7; Y= +1020.6)

C2: WC

(X= –349.4; Y= –1004.4)

C1: VCC

(X= +514.3; Y= –604.0)