11/13

M14C16, M14C04

Table 9. Ordering Information Scheme

Example:

M14C04

-

W

D20

Memory Capacity

Delivery Form

16

16 Kbit

D20

Module on Super 35 mm

film

04

4 Kbit

W2

Unsawn wafer (275

µm ±

25

µm thickness)

W4

Unsawn wafer (180

µm ±

15

µm thickness)

Operating Voltage

W

2.5 V to 5.5 V

S2x

Sawn wafer (275

µm ± 25

µm thickness)

S4x

Sawn wafer (180

µm ± 15

µm thickness)

where “x” indicates the sawing orientation, as follows (and as shown in Figure 11)

1

GND at top right

2

GND at bottom right

3

GND at bottom left

4

GND at top left

ORDERING INFORMATION

Devices are shipped from the factory with the

memory content set at all ‘1’s (FFh).

The notation used for the device number is as

shown in Table 9. For a list of available options

(speed, package, etc.) or for further information on

any aspect of this device, please contact the ST

Sales Office nearest to you.

Sawn wafers are scribed and mounted in a frame

on adhesive tape. The orientation is defined by the

position of the GND pad on the die, viewed with

active area of product visible, relative to the notch-

es of the frame (as shown in Figure 11). The orien-

tation of the die with respect to the plastic frame

notches is specified by the Customer.

One further concern, when specifying devices to

be delivered in this form, is that wafers mounted

on adhesive tape must be used within a limited pe-

riod from the mounting date:

– two months, if wafers are stored at 25°C, 55%

relative humidity

– six months, if wafers are stored at 4°C, 55% rel-

ative humidity