DD.M14C04/9811V1.1

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M14C04 DD

M14C04 Die Description

PRODUCT

M14C04

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WAFER SIZE

152 mm (6 inches)

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DIE IDENTIFICATION M14C04KA_R

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DIE SIZE (X x Y)

1465 x 1585

µm

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SCRIBE LINE

101.6 x 101.6

µm

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PAD OPENING

100 x 100

µm

DIE LAYOUT

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DI

Die Identification (at the position shown in Figure 1)

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C1, C2, C3, C5, C7

Pad contacts to the ISO pins (at the positions shown in Figure 1)

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C4, C6, C8

These ISO pins do not appear on the M14C04 die

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NC

This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and

vertical axis, measured in

µm).

Figure 1. M14C04 Die Plot

AI02497

C3: SCL

(X= –552.0; Y= –509.76)

C7: SDA

(X= –532.3; Y= +609.6)

DI

NC: TEST

NC: TEST

NC: TEST

C5: GND

(X= +442.8; Y= +626.0)

C2: WC (X= –386.96; Y= –609.76)

C1: VCC

(X= +551.9; Y= –605.0)