LM3544

SNVS062C – AUGUST 2000 – REVISED MAY 2013

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ABSOLUTE MAXIMUM RATINGS

(1) (2)

Voltage at INX and OUTX pins

−0.3V to 6V

Voltage at ENX(ENX) and FLAGX pins

−0.3V to 5.5V

Power Dissipation(3)

Internally Limited

Maximum Junction Temperature

150°C

Storage Temperature Range

−65°C to 150°C

Lead Temperature Range (Soldering, 5 sec.)

260°C

ESD Rating(4)

2 kV

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device beyond its rated operating conditions.

(3)

The maximum allowable power dissipation is a function of the Maximum Junction Temperature (TJMAX), Junction to Ambient Thermal

Resistance (

θJA), and the Ambient Temperature (TA). The LM3544 in the 16-pin SOIC package has a TJMAX of 150°C and a θJA of

130°C/W. The maximum allowable power dissipation at any temperature is PMAX = (TJMAX − TA)/θJA. Exceeding the maximum allowable

power dissipation will cause excessive die temperature, and the part will go into thermal shutdown.

(4)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin.

RECOMMENDED OPERATING CONDITIONS

Supply Voltage Range

2.7V to 5.5V

Continuous Output Current Range (Each Output)

0 mA to 500 mA

Junction Temperature Range

−40°C to 125°C

DC ELECTRICAL CHARACTERISTICS

Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: VIN = 5.0V, ENX = VIN (LM3544-H) or ENX = 0V (LM3544-L).

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

RON

On Resistance

VIN = 5V, IOUTX = 0.5A

90

125

m

Ω

VIN = 3.3V, IOUTX = 0.5A

95

130

IOUT

OUTX Continuous Output Current

3.0V

≤ VIN ≤ 5.5V

0.5

A

ILEAK-OUT

OUTX Leakage Current

ENX = 0 (ENX = VIN); TJ = 25°C

0.01

1

μA

ENX = 0 (ENX = VIN); − 40 ≤ TJ ≤

10

μA

125°C

ISC

OUTX Short-Circuit Current

(1)

OUTX Connected to GND

0.8

1.25

A

OCTHRESH

Overcurrent Threshold

2.0

3.2

A

VL_FLAG

FLAGX Output-Low Voltage

I(FLAGX) = 10 mA

0.1

0.3

V

ILEAK-FLAG

FLAGX Leakage Current

2.7

≤ VFLAG ≤ 5.5V

1

μA

ILEAK-EN

ENX Input Leakage Current

ENX/ENX = 0V or ENX/ENX = VIN

-0.5

0.5

μA

VIH

EN/EN Input Logic High

2.7V

≤ VIN ≤ 5.5V

2.4

V

VIL

EN/EN Input Logic Low

4.5V

≤ VIN ≤ 5.5V

0.8

V

2.7V

≤ VIN ≤ 4.5V

0.4

V

VUVLO

Under-Voltage Lockout Threshold

1.8

V

IDDON

Operational Supply Current

ENX = VIN (ENX = 0 ); TJ = 25°C

375

600

μA

ENX = VIN (ENX = 0 ); −40°C ≤ TJ ≤

800

μA

125°C

IDDOFF

Shutdown Supply Current

ENX = 0 (ENX = VIN); TJ = 25°C

1

μA

−40°C ≤ TJ ≤ 125°C

5

μA

(1)

Thermal Shutdown will protect the device from permanent damage.

4

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