Nexperia

PMPB07R3EN

30 V, N-channel Trench MOSFET

13. Soldering

SOT1220-2

Footprint information for reflow soldering of DFN2020M-6 package

sot1220-2_fr

occupied area

solder paste

solder resist

solder land

Dimensions in mm

Issue date 20-03-17

20-06-17

0.25

0.21 0.11

0.35

0.3

0.2

0.65

0.45

0.5

0.4

0.3

0.2

0.05

1.2

1.3

2.6

0.45

0.4

0.2

1.1

0.36 0.46 0.56

1.2

0.7

0.8

0.9

2.3

recommended stencil thickness: 0.1 mm

Fig. 19. Reflow soldering footprint for DFN2020M-6 (SOT1220-2)

PMPB07R3EN

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Product data sheet

27 November 2020

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