EV5424-R-00A datasheet(6/44 Pages) MPS

6 / 44 page

MP5424

– 5V POWER MANAGEMENT IC WITH I2C AND MTP

MP5424 Rev. 1.0

MonolithicPower.com

12/6/2021

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (3)

VIN1, VIN2, VIN3, VIN4, VIN5, VAVIN ...............................

………………….-0.3V to +6.5V (6.8V for 300ms)

VSWx ...................................................................

-0.6V (-5V for <10ns) to VINx + 0.3V (7V for <10ns)

All other pins............................. -0.3V to +6.25V

Continuous power dissipation (TA = 25°C) (4) (8)

QFN-26 (3.5mmx4.5mm)

………………....6.25W

Junction temperature ............................... 150°C

Lead temperature .................................... 260°C

Storage temperature................ -65°C to +150°C

ESD Ratings (5) (6)

Human body model (HBM) ....................... ± 2kV

Charged device model (CDM).................± 750V

Recommended Operating Conditions (7)

Step-down converter (VINx)............. 2.7V to 5.5V

Step-down converter (VOUTx)……........................

……………………………….0.4V to 3.58V or VINx

LDO regulator output (VLDOx)……………………...

……………………………...0.65V to 3.58V or VINx

Load switch output (VOUT_LSW) ........ 2.7V to 5.5V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

θJA

θJC

QFN-26 (3.5mmx4.5mm)

EV5424-R-00A (8) ................... 20 ....... 5.... °C/W

JESD51-7 (9) (10) ...................... 44 ....... 9.... °C/W

Notes:

3) Exceeding these ratings may damage the device.

4) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, and the

device may go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

5) HBM is measured in accordance with JEDEC specification

JESD22-A114. JEDEC document JEP155 states that a 500V

HBM allows for safe manufacturing with a standard ESD

control process.

6) CDM is measured in accordance with JEDEC specification

JESD22-C101. JEDEC document JEP157 states that a 250V

CDM allows for safe manufacturing with a standard ESD

control process.

7) The device is not guaranteed to function outside of its operating

conditions.

8) Measured on EV5424-R-00A, 4-layer PCB.

9) Measured on JESD51-7, 4-layer PCB. The values given in this

table are only valid for comparison with other packages and

cannot be used for design purposes.

10) These values were calculated in accordance with JESD51-7,

and simulated on a specified JEDEC board. They do not

represent the performance obtained in an actual application.

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