Package information

LCP02-150M

8/10

3

Package information

Figure 8.

Footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8.

PowerSO-10 Dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

3.35

3.65

0.131

0.143

A1

0.00

0.10

0.00

0.004

B

0.40

0.60

0.016

0.024

C

0.35

0.55

0.014

0.022

D

9.40

9.60

0.370

0.378

D1

7.40

7.60

0.291

0.299

E

9.30

9.50

0.366

0.374

E1

7.20

7.40

0.283

0.291

E2

7.20

7.60

0.283

0.299

E3

6.10

6.35

0.240

0.250

E4

5.90

6.10

0.232

0.240

e

1.27

0.05

F

1.25

1.35

0.049

0.053

H

13.80

14.40 0.543

0.567

h

0.50

0.019

L

1.20

1.80

0.047

0.071

Q

1.70

0.067

a0°

8°

0°

8°

E2

E

1

10

5

6

H

eB

0.25 M

D

h

A

F

A1

E4

E3 E1

SEATING

PLANE

SEATING

PLANE

A

B

C

Q

DETAIL "A"

0.10 A B

L

A1

a

DETAIL "A"

D1

1.27

9.5

0.67 - 0.73

0.54 - 0.60