LM3551SD datasheet(4/15 Pages) NSC

4 / 15 page

Electrical Characteristics(Notes 2, 9) (Continued)

Limits in standard typeface are for T

J = +25˚ C. Limits in boldface type apply over the full operating junction temperature range

(-40˚C

≤ T

≤ +110˚C). Unless otherwise noted, specifications apply to the LM3551 and LM3552 Typical Application Circuit (pg.

1) with: V

IN = 3.6V, V(SD) = 0V for LM3551 and V(EN) = VIN for LM3552, ILOAD = 0A (Note 10)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

T/F

T/F Pin Threshold

Output High

1.2

Output Low

0.3

UVP

Under Voltage Protection

Thresholds

On Threshold

2.25

2.48

2.70

Off Threshold

2.43

2.58

2.77

OVP

Over Voltage Protection

Thresholds

On Threshold

11.3

12.4

Off Threshold

9.2

10.6

FTO

Flash Timeout trip-point

0.99

1.16

1.32

FTO

Flash Timeout Current

1.12

1.4

1.68

µA

Soft-Start Voltage

1.18

1.25

1.32

Soft-Start Current

11.5

µA

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=140

oC (typ.) and disengages at

TJ=120

oC (typ.).

Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note: AN-1187 for Recommended Soldering

Profiles.

Note 5: The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Note 6: Maximum recommended SW pin voltage when the OVP pin is grounded.

Note 7: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =110

oC), the maximum power

dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX).

Note 8: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,

special care must be paid to thermal dissipation issues in board design.

Note 9: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm.

Unless otherwise specified, conditions for Typ specifications are: VIN = 3.6V and TA =25

oC.

Note 10: CIN and COUT,: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics

Note 11: Duty cycle affects current limit due to ramp generator.

Note 12: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. VIN

Note 13: Bias current flows into FB pin.

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