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USX2064 датащи(PDF) 40 Page - Microchip Technology |
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USX2064 датащи(HTML) 40 Page - Microchip Technology |
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40 / 54 page ![]() USX2064 DS00001986E-page 40 2023 Microchip Technology Inc and its subsidiaries. 6.2.1 PACKAGE THERMAL SPECIFICATIONS Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi- layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction temperature of the die. Use the following formulas to calculate the junction temperature: TJ = P x JA + TA TJ = P x JT + TT TJ = P x JC + TC TABLE 6-3: PACKAGE THERMAL RESISTANCE PARAMETERS Symbol USX2064 (°C/W) Velocity (Meters/s) JA 40.1 0 35.0 1 JT 0.5 0 0.7 1 JC 6.3 0 6.3 1 TABLE 6-4: LEGEND Symbol Description TJ Junction temperature P Power dissipated JA Junction-to-ambient-temperature JC Junction-to-top-of-package JT Junction-to-bottom-of-case TA Ambient temperature TC Temperature of the bottom of the case TT Temperature of the top of the case |
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