LTC6754

21

6754f

For more information www.linear.com/LTC6754

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

3.00

± 0.10

(4 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

±0.10

BOTTOM VIEW—EXPOSED PAD

1.65

±0.10

(4-SIDES)

0.75

±0.05

R = 0.115

TYP

0.25

±0.05

1

PIN 1 NOTCH R = 0.20 TYP

OR 0.25

× 45° CHAMFER

11 12

2

0.50 BSC

0.200 REF

2.10

±0.05

3.50

±0.05

0.70

±0.05

0.00 – 0.05

(UD12) QFN 0709 REV Ø

0.25

±0.05

0.50 BSC

PACKAGE OUTLINE

UD Package

12-Lead Plastic QFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1855 Rev Ø)

package DescripTion

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.