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CD4073BMS, CD4081BMS, CD4082BMS

Chip Dimensions and Pad Layouts

CD4081BMS

CD4082BMS

CD4073BMS

Dimensions in parentheses are in millimeters and are

derived from the basic inch dimensions as indicated.

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches