LTC1064-1

7

10641fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

N Package

14-Lead PDIP (Narrow 0.300)

(LTC DWG # 05-08-1510)

J Package

14-Lead CERDIP (Narrow 0.300, Hermetic)

(LTC DWG # 05-08-1110)

OBSOLETE PACKAGE

J14 0801

.045 – .065

(1.143 – 1.651)

.100

(2.54)

BSC

.014 – .026

(0.360 – 0.660)

.200

(5.080)

MAX

.015 – .060

(0.381 – 1.524)

.125

(3.175)

MIN

.300 BSC

(7.62 BSC)

.008 – .018

(0.203 – 0.457)

0° – 15°

1

23

4

56

7

.220 – .310

(5.588 – 7.874)

.785

(19.939)

MAX

.005

(0.127)

MIN

14

11

8

9

10

13

12

.025

(0.635)

RAD TYP

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

N14 1002

.020

(0.508)

MIN

.120

(3.048)

MIN

.130 ± .005

(3.302 ± 0.127)

.045 – .065

(1.143 – 1.651)

.065

(1.651)

TYP

.018 ± .003

(0.457 ± 0.076)

.005

(0.125)

MIN

.255 ± .015*

(6.477 ± 0.381)

.770*

(19.558)

MAX

3

1

2

4

5

6

7

8

9

10

11

12

13

14

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

S16 (WIDE) 0502

NOTE 3

.398 – .413

(10.109 – 10.490)

NOTE 4

16

15

14

13

12

11

10

9

1

N

23

4

5

6

78

N/2

.394 – .419

(10.007 – 10.643)

.037 – .045

(0.940 – 1.143)

.004 – .012

(0.102 – 0.305)

.093 – .104

(2.362 – 2.642)

.050

(1.270)

BSC

.014 – .019

(0.356 – 0.482)

TYP

0° – 8° TYP

NOTE 3

.009 – .013

(0.229 – 0.330)

.005

(0.127)

RAD MIN

.016 – .050

(0.406 – 1.270)

.291 – .299

(7.391 – 7.595)

NOTE 4

× 45°

.010 – .029

(0.254 – 0.737)

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. PIN 1 IDENT, NOTCH ON TOP

AND CAVITIES ON THE BOTTOM

OF PACKAGES ARE THE

MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED

WITH OR WITHOUT ANY OF THE

OPTIONS

4. THESE DIMENSIONS DO NOT

INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT

EXCEED .006" (0.15mm)

.420

MIN

.325 ±.005

RECOMMENDED SOLDER PAD LAYOUT

.045 ±.005

N

12

3

N/2

.050 BSC

.030 ±.005

TYP

SW Package

16-Lead Plastic Small Outline (Wide .300 Inch)

(Reference LTC DWG # 05-08-1620)