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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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L6221C датащи(PDF) 11 Page - STMicroelectronics |
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L6221C датащи(HTML) 11 Page - STMicroelectronics |
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11 / 15 page  Figure 25 : Maximum Dissipable Power and Junction to Ambient Ther- mal Resistance vs. Side ” α”. Figure 26 : Maximum Allowable Power Dissipation vs. Ambient Temperature. Figure 24 : External Heatsink Mounting Example. Figure 23 : Example of P.C. Board Copper Area Which is Used as Heatsink. MOUNTING INSTRUCTION The Rth j-amb of the L6221C can be reduced by sol- deringthe GND pins to a suitablecopperarea of the printed circuit board (Fig. 23) or to an external heatsink (Fig. 24). The diagram of figure 25 shows the maximum dis- sipable power Ptot and the Rth j-amb as a function of the side ” α” of two equalsquare copper areas hav- ing a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 sec- onds. The external heatsink or printed circuit copper area must be connected to electrical ground. L6221C-L6221CN-L6221CD 11/15 |
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