24LC024 datasheet(33/41 Pages) MICROCHIP

номер детали	24LC024

подробное описание детали	2-Kbit I2C Serial EEPROM

PDF	41 Pages

Scroll/Zoom	100%

производитель	MICROCHIP [Microchip Technology]

домашняя страница	http://www.microchip.com

Logo

33 / 41 page

 2007-2022 Microchip Technology Inc. and its subsidiaries

DS20001210Q-page 33

24AA024/24LC024/24AA025/24LC025

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

24LC024 датащи(PDF) 33 Page - Microchip Technology