ADV7520NK

Rev. 0 | Page 6 of 8

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-225

WITH THE EXCEPTION TO PACKAGE HEIGHT.

A

B

C

D

E

F

G

J

H

K

10

8

7

6

3

2

1

9

5

4

A1 CORNER

INDEX AREA

TOP VIEW

BALL A1

PAD CORNER

DETAIL A

BOTTOM VIEW

0.75

REF

6.10

6.00 SQ

5.90

SEATING

PLANE

BALL DIAMETER

0.15 MIN

0.35

0.30

0.25

COPLANARITY

0.08 MAX

0.65 MIN

0.50

BSC

4.50

BSC SQ

*1.40 MAX

DETAIL A

Figure 2. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

6 mm × 6 mm × 1.4 mm

(BC-76-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADV7520NKBBCZ-801

−25°C to +90°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76-1

ADV7520NKBBCZRL-801

−25°C to +90°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76-1

ADV7520NK/PCBZ1

Evaluation Board