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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TUSB8042AI датащи(PDF) 53 Page - Texas Instruments |
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TUSB8042AI датащи(HTML) 53 Page - Texas Instruments |
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53 / 64 page  www.ti.com PACKAGE OUTLINE C SEE DETAIL 64X 0.30 0.18 6 0.05 64X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 60X 0.5 2X 7.5 2X 7.5 A 9.1 8.9 B 9.1 8.9 (0.1) TYP VQFN - 1 mm max height RGC0064G PLASTIC QUAD FLATPACK - NO LEAD 4222053/B 06/2015 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 16 33 48 17 32 64 49 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 1.500 SCALE 8.000 LEADFRAME PROFILE OPTION www.ti.com TUSB8042A SLLSF93A – JUNE 2019 – REVISED JANUARY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 53 Product Folder Links: TUSB8042A |
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