ADC34RF72 datasheet(8/74 Pages) TI2

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5.4 Thermal Information

THERMAL METRIC(1)

ADC32RF72

UNIT

ANH (BGA)

289 Balls

RΘJA

Junction-to-ambient thermal resistance

15.4

℃/W

RΘJC(top)

Junction-to-case (top) thermal resistance

0.5

°C/W

RΘJB

Junction-to-board thermal resistance

4.2

°C/W

ΨJT

Junction-to-top characterization parameter

0.1

°C/W

ΨJB

Junction-to-board characterization parameter

4.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics - Power Consumption

Maximum and minimum values are specified over the operating free-air temperature range and nominal supply voltages.

Typical values are specified at TA = 25°C, ADC sampling rate = 1.5 GSPS, DDC Bypass mode, 50% clock duty cycle,

nominal supply voltages and –1-dBFS differential input, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IAVDD18

Supply current, 1.8V analog supply

Bypass mode

LMFS = 4-2-1-1

315

350

IAVDD12

Supply current, 1.2V analog supply

915

1100

IAVDDCLK18

Supply current, 1.8V clock supply

IAVDDCLK12

Supply current, 1.2V clock supply

IDVDD09

Supply current, 0.9V digital supply

1450

1800

IAVDDGPIO18

Supply current, 1.8V GPIO supply

PDIS

Power dissipation

3.1

POWER DOWN MODES

PDIS

Fast power down mode power consumption

Fast wake up time

2.0

PDIS

Global power down mode power consumption

0.4

ADC32RF72

SBASAL2 – NOVEMBER 2025

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