THERMAL METRIC(1)

Device

UNIT

DGS (VSSOP)

RSW (UQFN)

10 PINS

10 PINS

ψJB

Junction-to-board characterization parameter

121.6

21.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

TEST CONDITIONS

MIN

TYP(2)

MAX

UNIT

VIK

Control inputs clamp voltage

VCC = 3V, II = –18mA

–1.2

V

IIN

Control inputs

VCC = 4.3V, 0V, VIN = 0V to 4.3V

±1

μA

IOZ

D+ and D– OFF-state leakage current(3)

VCC = 4.3V, VO = 0V to 3.6V, VI = 0V,

Switch OFF

±1

μA

IOFF

Powered off leakage current

VCC = 0V, VO = 0V to 4.3V, VI = 0V,

VIN = VCC or GND

±2

μA

ICC

Supply current

VCC = 4.3V, II/O = 0mA,

Switch ON or OFF

1

μA

ΔICC (4)

Control inputs

VCC = 4.3V, VIN = 2.6V

10

μA

Cin

Control inputs digital input capacitance

VCC = 0V,

VIN = VCC or GND

1

pF

Cio(OFF)

OFF-state input capacitance

VCC = 3.3V, VI/O = 3.3V or 0V,

Switch OFF

2

pF

Cio(ON)

ON-state input capacitance

VCC = 3.3V, VI/O = 3.3V or 0V,

Switch ON

7.5

pF

RON

ON-state resistance(5)

VCC = 3V, VI = 0.4V, IO = –8mA

6

10

Ω

ΔRON

ON-state resistance match between channels

VCC = 3V, VI = 0.4V, IO = –8mA

0.35

Ω

ron(flat)

ON-state resistance flatness

VCC = 3V, VI = 0V or 1V, IO = –8mA

2

Ω

(1)

VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.

(2)

All typical values are at VCC = 3.3V (unless otherwise noted), TA = 25°C.

(3)

For I/O ports, the parameter IOZ includes the input leakage current.

(4)

This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.

(5)

Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

5.6 Dynamic Electrical Characteristics

over operating range, TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V

PARAMETER

TEST CONDITIONS

TYP(1)

UNIT

XTALK

Crosstalk

RL = 50Ω, f = 240MHz, See Figure 6-3

–32

dB

OISO

OFF isolation

RL = 50Ω, f = 240MHz, See Figure 6-2

–32

dB

BW

Bandwidth (–3 dB)

RL = 50Ω, See Figure 6-4

1400

MHz

(1)

For minimum or maximum conditions, use the appropriate value specified under Electrical Characterisics for the applicable device

type.

5.7 Switching Characteristics

over operating range, TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V

PARAMETER

TEST CONDITIONS

MIN

TYP(1)

MAX

UNIT

tpd

Propagation delay(2) (3)

RL = 50Ω, CL = 5pF, At 480Mbps,

See Figure 6-5

0.25

ns

tON

Line enable time, SEL to D, nD

RL = 50Ω, CL = 5pF,

See Figure 6-1

30

ns

tOFF

Line disable time, SEL to D, nD

RL = 50Ω, CL = 5pF,

See Figure 6-1

25

ns

tON

Line enable time, OE to D, nD

RL = 50Ω, CL = 5pF,

See Figure 6-1

30

ns

tOFF

Line disable time, OE to D, nD

RL = 50Ω, CL = 5pF,

See Figure 6-1

25

ns

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TS3USB30E

SCDS255G – DECEMBER 2008 – REVISED OCTOBER 2024

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