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EXAMPLE BOARD LAYOUT

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

4X (0.9)

12X (0.2)

(1.3)

(1.6)

8X (0.4)

8X (0.6)

WQFN - 0.8 mm max height

RMG0012A

PLASTIC QUAD FLATPACK - NO LEAD

4226797/B 04/2024

SEE SOLDER MASK

DETAIL

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

SYMM

1

2

3

6

7

8

9

12

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 30X

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS