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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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REF5010AID датащи(PDF) 6 Page - Texas Instruments |
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REF5010AID датащи(HTML) 6 Page - Texas Instruments |
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6 / 52 page  6.4 Thermal Information THERMAL METRIC(1) REF50xxEI REF50xxI , REF50xxAI UNIT D (SOIC) D (SOIC) DGK (VSSOP) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 120 115 160.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52 63.4 53.9 °C/W RθJB Junction-to-board thermal resistance 66 57.1 82.9 °C/W ΨJT Junction-to-top characterization parameter 9.8 15.4 5.1 °C/W ΨJB Junction-to-board characterization parameter 64.7 56.2 80.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. REF50, REF50E SBOS410O – JUNE 2007 – REVISED OCTOBER 2025 www.ti.com 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: REF50 REF50E |
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