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IS25LE512MG-RLLA2:PTY датащи(PDF) 108 Page - Integrated Silicon Solution, Inc |
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IS25LE512MG-RLLA2:PTY датащи(HTML) 108 Page - Integrated Silicon Solution, Inc |
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108 / 194 page ![]() IS25LE512MG IS25WE512MG Integrated Silicon Solution, Inc.- www.issi.com 108 Rev. A6 10/02/2025 8.26 RELEASE DEEP POWER DOWN (RDPD, ABh) The Release Deep Power-down/Read Device ID instruction is a multi-purpose command. To release the device from the deep power-down mode, the instruction is issued by driving the CE# pin low, shifting the instruction code into the device and driving CE# high. Releasing the device from Power-down mode will take the time duration of tRES1 before normal operation is restored and other instructions are accepted. The CE# pin must remain high during the tRES1 time duration. If the Release Deep Power-down/RDID instruction is issued while an Erase, Program or Write cycle is in progress (WIP=1) the instruction is ignored and will not have any effects on the current cycle. Figure 8.58 Release Power Down Mode Sequence In SPI Mode tRES1 Instruction = ABh CE # SCK SI 0 1 2 3 4 5 6 7 Mode 3 Mode 0 SO High Impedance Figure 8.59 Release Power Down Mode Sequence In QPI Mode tRES1 ABh CE# SCK IO[3:0] 0 1 Mode 3 Mode 0 |
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