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EXAMPLE STENCIL DESIGN

8X (1.4)

8X (0.45)

6X (0.65)

(4.4)

(R0.05) TYP

(1.6)

BASED ON

0.125 THICK

STENCIL

(1.92)

BASED ON

0.125 THICK

STENCIL

HVSSOP - 1.1 mm max height

DGN0008C

SMALL OUTLINE PACKAGE

4218838/A 11/2017

1.35 X 1.62

0.175

1.46 X 1.75

0.15

1.60 X 1.92 (SHOWN)

0.125

1.79 X 2.15

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

EXPOSED PAD 9:

100% PRINTED SOLDER COVERAGE BY AREA

SCALE: 15X

SYMM

SYMM

1

4

5

8

METAL COVERED

BY SOLDER MASK

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES