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PACKAGE OUTLINE

C

6X 0.65

2X

1.95

8X

0.38

0.25

5.05

4.75

TYP

SEATING

PLANE

0.15

0.05

0.25

GAGE PLANE

0 -8

1.1 MAX

0.23

0.13

1.846

1.646

2.15

1.95

B

3.1

2.9

NOTE 4

A

3.1

2.9

NOTE 3

0.7

0.4

PowerPAD

HVSSOP - 1.1 mm max height

DGN0008G

SMALL OUTLINE PACKAGE

4225480/C 11/2024

1

4

5

8

0.13

C A B

PIN 1 INDEX AREA

SEE DETAIL A

0.1 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-187.

PowerPAD is a trademark of Texas Instruments.

TM

A 20

DETAIL A

TYPICAL

SCALE 4.000

EXPOSED THERMAL PAD

1

4

5

8

9