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TPA3136D2 датащи(PDF) 6 Page - Texas Instruments |
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TPA3136D2 датащи(HTML) 6 Page - Texas Instruments |
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6 / 41 page ![]() 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT VCC Supply voltage PVCC, AVCC 3.5 14.4 V VIH High-level input voltage SD/ FAULT (1), MUTE, GAIN_SEL, MODE_SEL 2 AVCC V VIL Low-level input voltage SD/ FAULT, MUTE, GAIN_SEL, MODE_SEL(2) 0.8 V VOL Low-level output voltage SD/ FAULT, RPULL-UP =100 kΩ, PVCC = 14.4 V 0.8 V IIH High-level input current SD/ FAULT, MUTE, GAIN_SEL, MODE_SEL, VI = 2 V, AVCC = 12 V 50 µA IIL Low-level input current SD/ FAULT, MUTE, GAIN_SEL, MODE_SEL, VI = 0.8 V, AVCC = 12 V 5 µA TA Operating free-air temperature(3) (4) –10 85 °C TJ Operating junction temperature(3) -10 150 °C (1) Set SD/ FAULT to high level, make sure the pull-up resistor is larger than 4.7 kΩ and smaller than 500 kΩ (2) Set GAIN_SEL and MODE_SEL to low level, make sure pull down resistor<10 kΩ (3) The TPA3138D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SLMA002 for more information about using the TSSOP thermal pad. (4) TPA3139D2 supports -40°C ~85°C ambient temperature range with ≤12 V operating PVDD range. 6.4 Thermal Information THERMAL METRIC(1) TPA3139D2 UNIT RGE (QFN) 24 PINS RθJA Junction-to-ambient thermal resistance 37.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 35.1 °C/W RθJB Junction-to-board thermal resistance 16.8 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 16.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7.3 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. TPA3139D2 SLOS810A – OCTOBER 2019 – REVISED AUGUST 2020 www.ti.com 6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: TPA3139D2 |
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