D3+

D4+

SCL

SDA

THERM

ADD

V+

THERM2

D3

C1

D1

D4

C4

B4

TMP468

C3

B3

D5+

D6+

A2

B2

D1+

D2+

D-

D7+

A1

B1

C2

A3

GND

A4

D8+

D2

CDIFF

RS1

RS2

CDIFF

RS1

RS2

CDIFF

RS1

RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

CDIFF

RS1 RS2

1.7 V to 3.6 V

CBYPASS

RSCL RSDA

RT

RT2

2-Wire Interface

SMBus / I

2C

Compatible

Controller

Overtemperature

Shutdown

Local

Zone 9

Remote

Zone 1

Remote

Zone 2

Remote

Zone 3

Remote

Zone 4

Remote

Zone 5

Remote

Zone 6

Remote

Zone 7

Remote

Zone 8

Copyright © 2016, Texas Instruments Incorporated

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TMP468

SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017

TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor

1

1 Features

1

•

8-Channel Remote Diode Temperature Sensor

Accuracy: ±0.75°C (Maximum)

•

Local and Remote Diode Accuracy: ±0.75°C

(Maximum)

•

Local Temperature Sensor Accuracy for the

DSBGA Package: ±0.35°C (Maximum)

•

Temperature Resolution: 0.0625°C

•

Supply and Logic Voltage Range: 1.7 V to 3.6 V

•

67-µA Operating Current (1 SPS, All Channels

Active)

•

0.3-µA Shutdown Current

•

Remote Diode: Series Resistance Cancellation,

η-Factor Correction, Offset Correction, and Diode

Fault Detection

•

Register Lock Function Secures Key Registers

•

I2C or SMBus™ Compatible Two-Wire Interface

With Pin-Programmable Address

•

16-Bump DSBGA and 16-Pin VQFN Packages

2 Applications

•

MCU, GPU, ASIC, FPGA, DSP, and CPU

Temperature Monitoring

•

Telecommunication Equipment

•

Servers and Personal Computers

•

Cloud Ethernet Switches

•

Secure Data Centers

•

Highly Integrated Medical Systems

•

Precision Instruments and Test Equipment

•

LED Lighting Thermal Control

3 Description

The TMP468 device is a multi-zone, high-accuracy,

low-power temperature sensor using a two-wire,

SMBus or I2C compatible interface. Up to eight

remote diode-connected temperature zones can be

monitored simultaneously in addition to the local

temperature.

Aggregating

the

temperature

measurements across a system allows improved

performance through tighter guard bands and can

reduce board complexity. A typical use case is for

monitoring

the

temperature

across

different

processors, such as MCUs, GPUs, and FPGAs in

complex

systems

such

as

servers

and

telecommunications equipment. Advanced features

such as series resistance cancellation, programmable

non-ideality

factor,

programmable

offset,

and

programmable temperature limits are included to

provide a robust thermal monitoring solution with

improved accuracy and noise immunity.

Each of the eight remote channels (and the local

channel) can be programmed independently with two

thresholds that are triggered when the corresponding

temperature is exceeded at the measured location. In

addition, there is a programmable hysteresis setting

to avoid constant toggling around the threshold.

The TMP468 device provides high accuracy (0.75°C)

and

high

resolution

(0.0625°C)

measurement

capabilities. The device supports low voltage rails

(1.7 V to 3.6 V), common two-wire interfaces, and is

available in a small, space efficient package (3 mm ×

3 mm or 1.6 mm × 1.6 mm) for easy integration into

computing systems. The remote junction supports a

temperature range from –55°C to +150°C.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TMP468

DSBGA (16)

1.60 mm × 1.60 mm

VQFN (16)

3.00 mm × 3.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application Schematic

See the Design Requirements section for remote diode recommendations.