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TMP468

SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017

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Copyright © 2016–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Two-Wire Timing Requirements ............................... 7

6.7

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 10

7.1

Overview ................................................................. 10

7.2

Functional Block Diagram ....................................... 10

7.3

Feature Description................................................. 11

7.4

Device Functional Modes........................................ 13

7.5

Programming........................................................... 13

7.6

Register Maps ......................................................... 19

8

Application and Implementation ........................ 29

8.1

Application Information............................................ 29

8.2

Typical Application .................................................. 30

9

Power Supply Recommendations ...................... 33

10

Layout................................................................... 34

10.1

Layout Guidelines ................................................. 34

10.2

Layout Example .................................................... 35

11

Device and Documentation Support ................. 37

11.1

Receiving Notification of Documentation Updates 37

11.2

Community Resources.......................................... 37

11.3

Trademarks ........................................................... 37

11.4

Electrostatic Discharge Caution ............................ 37

11.5

Glossary ................................................................ 37

12

Mechanical, Packaging, and Orderable

Information ........................................................... 37

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (March 2017) to Revision B

Page

•

Updated packaging information ........................................................................................................................................... 37

Changes from Original (November 2016) to Revision A

Page

•

Added 16-pin VQFN package version throughout data sheet................................................................................................ 1

•

Deleted Description (cont.) section and moved text to Description section .......................................................................... 1

•

Added VQFN package and body size information to Device Information table .................................................................... 1

•

Added copyright statement to Typical Application Schematic................................................................................................ 1

•

Added RGT (VQFN) pinout diagram in the Pin Configuration and Functions section .......................................................... 4

•

Added remote junction temperature parameter and values to Recommended Operating Conditions table ......................... 5

•

Changed formatting of Thermal Information table note ......................................................................................................... 5

•

Changed TMP468 Thermal Information table package from "RGT (QFN)" to "RGT (VQFN)" .............................................. 5

•

Updated formatting of Two-Wire Timing Requirements table ............................................................................................... 7

•

Changed Timing Requirements table note parameter from tVD;DATA to tVD;DAT ........................................................................ 7

•

Added 2017 copyright to Functional Block Diagram ........................................................................................................... 10

•

Changed table headers in Continuous Conversion Times table ......................................................................................... 26

•

Added 2017 copyright to Typical Application schematic in Application Information section ................................................ 30

•

Changed η-factor setting from 1.003674 to 1.0067 in Figure 23 table note in Typical Application section ......................... 30

•

Changed conversion rate from 16 conversions/second to 1 conversion/second in the Detailed Design Procedure

section .................................................................................................................................................................................. 32

•

Changed units of Equation 7 from "µs" to "µA" .................................................................................................................... 32