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TLV172, TLV2172, TLV4172

SBOS784C – NOVEMBER 2016 – REVISED JANUARY 2019

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Product Folder Links: TLV172 TLV2172 TLV4172

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Copyright © 2016–2019, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: TLV172

THERMAL METRIC(1)

TLV172

UNIT

D (SOIC)

DBV (SOT-23)

DCK (SC70)

8 PINS

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

126.5

227.9

285.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

80.6

115.7

60.5

°C/W

RθJB

Junction-to-board thermal resistance

67.1

65.9

78.9

°C/W

ψJT

Junction-to-top characterization parameter

31.0

10.7

0.8

°C/W

ψJB

Junction-to-board characterization parameter

65.6

65.3

77.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: TLV2172

THERMAL METRIC(1)

TLV2172

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

116.1

158

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

69.8

48.6

°C/W

RθJB

Junction-to-board thermal resistance

56.6

78.7

°C/W

ψJT

Junction-to-top characterization parameter

22.5

3.9

°C/W

ψJB

Junction-to-board characterization parameter

56.1

77.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: TLV4172

THERMAL METRIC(1)

TLV4172

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

82.7

111.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

42.3

40.8

°C/W

RθJB

Junction-to-board thermal resistance

37.3

54.1

°C/W

ψJT

Junction-to-top characterization parameter

8.9

3.8

°C/W

ψJB

Junction-to-board characterization parameter

37

53.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W