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TLV313 датащи(PDF) 2 Page - Texas Instruments

номер детали TLV313
подробное описание детали  TLVx313 Low-Power, Rail-to-Rail In/Out, 500-μV Typical Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  44 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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TLV313 датащи(HTML) 2 Page - Texas Instruments

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TLV313, TLV2313, TLV4313
SBOS753B – JUNE 2016 – REVISED FEBRUARY 2017
www.ti.com
Product Folder Links: TLV313 TLV2313 TLV4313
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Device Comparison Table..................................... 3
6
Pin Configuration and Functions ......................... 3
7
Specifications......................................................... 6
7.1
Absolute Maximum Ratings ...................................... 6
7.2
ESD Ratings.............................................................. 6
7.3
Recommended Operating Conditions ....................... 6
7.4
Thermal Information: TLV313 ................................... 7
7.5
Thermal Information: TLV2313 ................................. 7
7.6
Thermal Information: TLV4313 ................................. 7
7.7
Electrical Characteristics: 5.5 V ................................ 8
7.8
Electrical Characteristics: 1.8 V .............................. 10
7.9
Typical Characteristics: Table of Graphs ................ 12
7.10
Typical Characteristics .......................................... 13
8
Detailed Description ............................................ 16
8.1
Overview ................................................................. 16
8.2
Functional Block Diagram ....................................... 16
8.3
Feature Description................................................. 17
8.4
Device Functional Modes........................................ 18
9
Application and Implementation ........................ 19
9.1
Application Information............................................ 19
9.2
Typical Application ................................................. 19
9.3
System Examples .................................................. 20
10
Power Supply Recommendations ..................... 21
10.1
Input and ESD Protection ..................................... 21
11
Layout................................................................... 22
11.1
Layout Guidelines ................................................. 22
11.2
Layout Example .................................................... 22
12
Device and Documentation Support ................. 23
12.1
Documentation Support ........................................ 23
12.2
Receiving Notification of Documentation Updates 23
12.3
Related Links ........................................................ 23
12.4
Community Resources.......................................... 23
12.5
Trademarks ........................................................... 23
12.6
Electrostatic Discharge Caution ............................ 23
12.7
Glossary ................................................................ 23
13
Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2016) to Revision B
Page
•
Changed pin assignment for DCK package ........................................................................................................................... 3
Changes from Original (June 2016) to Revision A
Page
•
Changed Product Status from Product Preview to Production Data ..................................................................................... 1
•
Changed the formatting of the Related Documentation section .......................................................................................... 23
•
Changed wording in the Receiving Notification of Documentation Updates section .......................................................... 23



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