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TLV07IDRG4 датащи(PDF) 4 Page - Texas Instruments

номер детали TLV07IDRG4
подробное описание детали  TLV07 36-V Precision, Rail-to-Rail Output Operational Amplifier
PDF  29 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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TLV07IDRG4 датащи(HTML) 4 Page - Texas Instruments

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4
TLV07
SBOS832A – JULY 2017 – REVISED AUGUST 2017
www.ti.com
Product Folder Links: TLV07
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Short-circuit to ground, one amplifier per package.
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.
(1)
MIN
MAX
UNIT
Supply voltage
–20
20
V
Single supply voltage
40
V
Signal input pin voltage
(V–) – 0.5
(V+) + 0.5
V
Signal input pin current
–10
10
mA
Output short-circuit current(2)
Continuous
Operating ambient temperature, TA
–40
125
°C
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VS
Supply voltage (VS = V+ – V–)
2.7
36
V
TA
Operating temperature
–40
125
°C
6.4 Thermal Information: TLV07
THERMAL METRIC
TLV07
UNIT
D (SOIC)
8 PINS
RθJA
Junction-to-ambient thermal resistance
149.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
97.9
°C/W
RθJB
Junction-to-board thermal resistance
87.7
°C/W
ψJT
Junction-to-top characterization parameter
35.5
°C/W
ψJB
Junction-to-board characterization parameter
89.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W



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