NP0 datasheet(21/27 Pages) MULTICOMP

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Page <21>

V1.0

24/12/22

Automotive Multilayer Ceramic Capacitors

10 to 100V (NP0, X7R Dielectrics)

Newark.com/multicomp-pro

Farnell.com/multicomp-pro

sg.element14.com/b/multicomp-pro

No AEC-Q200

Test Item

AEC-Q200 Test Condition

Requirements

Rated voltage

Insulation

Resistance

100V: All X7R;1210≥3.3μF

10GΩ or R × C

≥100Ω-F

whichever is

smaller.

50V: 0402>0.01μF;0603≥1μF;0805≥1μF;1206≥4.7μF;1210≥4.7μF

35V: 0603≥1μF;0805≥2.2μF;1206≥2.2μF;1210≥10μF

25V: 02010≥1uF;04020≥22μF;06032≥2μF;0805≥2.2μF;

1206≥10μF;1210≥10μF

16V: 02010≥1uF;04020≥22μF;0603≥1μF;0805≥2.2μF;

1206≥10μF;1210≥47μF

10V: 0201≥47nF;0402≥0.47μF;06030≥47μF;0805≥2.2μF;

1206≥4.7μF;1210≥47μF

6.3V; 4V; Size≥1812

Rated voltage

Insulation

Resistance

100V: 1210≥3.3μF

RxC≥50Ω-F.

50V: 0402≥0.1μF;0603≥2.2μF;0805≥10μF;1206≥10μF

35V: 0603≥1μF;

25V: 0201≥0.1μF;0402≥2.2μF;0603≥10μF;0805≥10μF;1206≥22μF

16V: 0603≥10μF;0402≥1μF;0201≥0.22μF

6.3V: 0201≥0.1μF;0402≥1μF;0603>4.7μF;0805≥47μF;1206≥10μF

4V: 0603≥22μF;0805≥47μF;1206≥100μF

16. Solderability

J-STD-002

JESD22-B102E

* Condition A

Un-mounted chips

4hrs / 155°C*dry then

completely immersed for

5±0.5 sec in solder bath

at 235±5°C.

* Condition B

Un-mounted chips steam

8 hrs then completely

immersed for 10±1sec in

solder bath at 215+5/-0°C.

* Condition C

Un-mounted chips steam

8 hrs then completely

immersed for 10±1 sec. in

solder bath at 260+0/-5°C.

All terminations shall exhibit a continuous solder coating free from

defects from a minimum of 95% of the critical surface area of any

individual termination.

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