6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS02

UNIT

PW (TSSOP)

D (SOIC)

BQA (WQFN)

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

151.7

133.6

109.7

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

79.4

89.0

111.0

°C/W

RθJB

Junction-to-board thermal resistance

94.7

89.5

77.9

°C/W

ΨJT

Junction-to-top characterization

parameter

25.2

45.5

20.2

°C/W

ΨJB

Junction-to-board characterization

parameter

94.1

89.1

77.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

N/A

56.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

over operating free-air temperature range; typical ratings measured at TA = 25°C (unless otherwise noted).

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX UNIT

VT+

Positive switching threshold

2 V

0.7

1.5

V

4.5 V

1.7

3.15

6 V

2.1

4.2

VT-

Negative switching threshold

2 V

0.3

1.0

V

4.5 V

0.9

2.2

6 V

1.2

3.0

ΔVT

Hysteresis (VT+ - VT-)

2 V

0.2

1.0

V

4.5 V

0.4

1.4

6 V

0.6

1.6

VOH

High-level output voltage

VI = VIH or VIL

IOH = -20 µA

2 V to 6 V

VCC – 0.1

VCC – 0.002

V

IOH = -6 mA

4.5 V

4.0

4.3

IOH = -7.8 mA

6 V

5.4

5.75

VOL

Low-level output voltage

VI = VIH or VIL

IOL = 20 µA

2 V to 6 V

0.002

0.1

V

IOL = 6 mA

4.5 V

0.18

0.30

IOL = 7.8 mA

6 V

0.22

0.33

II

Input leakage current

VI = VCC or 0

6 V

±100

±1000

nA

ICC

Supply current

VI = VCC or 0, IO = 0

6 V

0.1

2

µA

Ci

Input capacitance

2 V to 6 V

5

pF

Cpd

Power dissipation capacitance

per gate

No load

2 V to 6 V

10

pF

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SN74HCS02

SCLS776B – DECEMBER 2019 – REVISED JANUARY 2021

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