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A21SP16 датащи(PDF) 35 Page - STMicroelectronics

номер детали A21SP16
подробное описание детали  3 W filter-free class-D audio power amplifier
PDF  37 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

A21SP16 датащи(HTML) 35 Page - STMicroelectronics

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A21SP16
Package information
37
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 67. Pin-out for 9-bump flip-chip (top view)
Figure 68. Marking for 9-bump flip-chip (top view)
Figure 69. Mechanical data for 9-bump flip-chip
V
DD
1/A1
7/C1
8/C2
9/C3
4/B1
6/B3
2/A2
3/A3
5/B2
V
DD
IN
-
IN
+
GND
STBY
GND
OUT
+
OUT
-
V
DD
1/A1
7/C1
8/C2
9/C3
4/B1
6/B3
2/A2
3/A3
5/B2
V
DD
IN
-
IN
+
GND
STBY
GND
OUT
+
OUT
-
 Bumps are underneath
 Bump diameter = 300m
 ST Logo
 Symbol for lead-free: E
 Two first XX product code: W2
 third X: Assembly code
 Three digits date code: Y for year - WW for week
 The dot is for marking pin A1
XXX
YWW
E
XXX
YWW
E
Die size: 1.6 mm x 1.6 mm ±30
m
Die height (including bumps): 600
m
Bump diameter: 315
m 50 m
Bump diameter before reflow: 300
m 10 m
Bump height: 250
m ±40 m
Die height: 350
m ±20 m
Pitch: 500
m 50 m
Coplanarity: 50
m max
1.60 mm
1.60 mm
0.5mm
0.5mm
 0.25mm
1.60 mm
1.60 mm
0.5mm
0.5mm
 0.25mm
600µm
600µm



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