www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(3.3)

(3.3)

8X (0.5)

14X (0.6)

14X (0.24)

( 2.05)

(0.775)

(0.775)

2X (1.5)

(

) VIA

TYP

0.2

(R

) TYP

0.05

VQFN - 1 mm max height

RGY0014A

PLASTIC QUAD FLATPACK - NO LEAD

4219040/A 09/2015

SYMM

1

14

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

2

6

7

8

9

13

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)