Figure 7. Forward voltage drop versus forward current

IFM(A)

0.1

1.0

10.0

100.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

VFM(V)

Tj=25 °C

(Maximum values)

Tj=125 °C

(Typical values)

Tj=125 °C

(Maximum values)

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab

Rth(j-a) (°C/W)

0

50

100

150

200

250

0

1

2

3

4

5

6

7

8

9

10

PowerFLAT (3.3x3.3)

SCu(cm²)

epoxy printed board FR4, copper thickness=35µm

STPS8L30DEE

Characteristics (curves)

DS9066 - Rev 2

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