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LP38690, LP38692

SNVS322M – DECEMBER 2004 – REVISED DECEMBER 2015

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Product Folder Links: LP38690 LP38692

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Copyright © 2004–2015, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 6

7

Detailed Description ............................................ 11

7.1

Overview ................................................................. 11

7.2

Functional Block Diagrams ..................................... 11

7.3

Feature Description................................................. 13

7.4

Device Functional Modes........................................ 13

8

Application and Implementation ........................ 14

8.1

Application Information............................................ 14

8.2

Typical Applications ................................................ 15

9

Power Supply Recommendations ...................... 18

10

Layout................................................................... 18

10.1

PCB Layout ........................................................... 18

10.2

Layout Examples................................................... 19

10.3

WSON Mounting ................................................... 19

10.4

RFI/EMI Susceptibility ........................................... 20

10.5

Output Noise ......................................................... 20

11

Device and Documentation Support ................. 21

11.1

Documentation Support ....................................... 21

11.2

Related Links ........................................................ 21

11.3

Community Resources.......................................... 21

11.4

Trademarks ........................................................... 21

11.5

Electrostatic Discharge Caution ............................ 21

11.6

Glossary ................................................................ 21

12

Mechanical, Packaging, and Orderable

Information ........................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision L (March 2015) to Revision M

Page

•

Added top navigator icon for TI Designs ............................................................................................................................... 1

•

Added Caution note to Foldback Current Limiting subsection ............................................................................................ 13

Changes from Revision K (December 2014) to Revision L

Page

•

Changed "mA" back to "mV" - error from SDS conversion. ................................................................................................... 5

Changes from Revision J (April 2013) to Revision K

Page

•

Changed Device Information and ESD Rating tables, Feature Description, Device Functional Modes, Application

and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and

Mechanical, Packaging, and Orderable Information sections; update Thermal Values moved some curves to

Application Curves section; change package name PFM to TO-252 (National to TI nomenclature) and pin names

from VIN, VOUT to IN, OUT. ................................................................................................................................................. 1

Changes from Revision I (April 2013) to Revision J

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 20