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LP5030 датащи(PDF) 51 Page - Texas Instruments

номер детали LP5030
подробное описание детали  LP503x 36-, 30-Channel 12-Bit PWM Ultra-low Quiescent Current I2C RGB LED Drivers
PDF  62 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

LP5030 датащи(HTML) 51 Page - Texas Instruments

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51
LP5030, LP5036
www.ti.com
SLVSEH1B – SEPTEMBER 2018 – REVISED JANUARY 2019
Product Folder Links: LP5030 LP5036
Submit Documentation Feedback
Copyright © 2018–2019, Texas Instruments Incorporated
10 Power Supply Recommendations
The device is designed to operate from a VVCC input-voltage supply range between 2.7 V and 5.5 V. This input
supply must be well-regulated and able to withstand maximum input current and maintain stable voltage without
voltage drop even in a load-transition condition (start-up or rapid intensity change). The resistance of the input
supply rail must be low enough that the input-current transient does not cause a drop below the 2.7-V level in the
LP503x VVCC supply voltage.
11 Layout
11.1 Layout Guidelines
To prevent thermal shutdown, the junction temperature, TJ, must be less than T(TSD). If the voltage drop across
the output channels is high, the device power dissipation can be large. The LP503x device has very good
thermal performance because of the thermal pad design; however, the PCB layout is also very important to
ensure that the device has good thermal performance. Good PCB design can optimize heat transfer, which is
essential for the long-term reliability of the device.
Use the following guidelines when designing the device layout:
Put the CVCAP, CVCC and RIREF as close as possible to the device. Also, TI recommends placing the ground
plane as shown in Figure 81 and Figure 82.
Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat
flow path from the package to the ambient is through copper on the PCB. Maximum copper density is
extremely important when no heat sinks are attached to the PCB on the other side from the package.
Add as many thermal vias as possible directly under the package ground pad to maximize the thermal
conductivity of the board.
Use either plated-shut or plugged and capped vias for all the thermal vias on both sides of the board to
prevent solder voids. To ensure reliability and performance, the solder coverage must be at least 85%.



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