4

LP38690, LP38692

SNVS322M – DECEMBER 2004 – REVISED DECEMBER 2015

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Copyright © 2004–2015, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to

ground.

(3)

At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a

heatsink is used). When using the WSON package, refer to TI Application Report AN-1187 Leadless Leadframe Package (LLP)

(SNOA401) and the WSON Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified

limits, the device goes into thermal shutdown.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

V(max) All pins (with respect to GND)

–0.3

12

V

IOUT

(2)

Internally limited

Junction temperature

−40

150

°C

Lead temperature (soldering, 5 seconds)

260

Power dissipation(3)

Internally limited

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN supply voltage

2.7

10

V

Operating junction temperature

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance, High-K.

6.4 Thermal Information

THERMAL METRIC(1)

LP38690

LP38690/92

LP38692

UNIT

TO-252

WSON

SOT-223

3 PINS

6 PINS

5 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

50.5

50.6

68.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.6

44.4

52.2

°C/W

RθJB

Junction-to-board thermal resistance

29.7

24.9

13.0

°C/W

ψJT

Junction-to-top characterization parameter

4.8

0.4

5.5

°C/W

ψJB

Junction-to-board characterization parameter

29.3

25.1

12.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.5

5.4

n/a

°C/W